Different Storage Conditions have Different Whisker Growth Mechanisms-Can Bright Tin be an Alternative to Matt Tin ?

With the three iNEMI storage conditions for testing the whisker growth having become widely accepted, an extensive data base has been generated at the IC assembly houses, connector manufacturers and plating electrolyte suppliers as to understand the reasons and circumstances of this troublesome phenomenon. It has been found that whiskers from pure tin can develop during all different conditions. The underlying growth mechanism however varies for the individual circumstances and no single solution exists to prevent whiskers in general. Only a combination of preventive measures, each targeting a singular growth mechanism, can become the universal mitigation solution.