DocumentCode :
3054021
Title :
Parametric Test Metrics Estimation Using Non-gaussian Copulas
Author :
Beznia, Kamel ; Bounceur, Ahcène ; Mir, Salvador ; Euler, Reinhardt
Author_Institution :
Xab-STICC Lab., Eur. Univ. of Britanny, Brest, France
fYear :
2011
fDate :
16-18 May 2011
Firstpage :
48
Lastpage :
52
Abstract :
The evaluation of parametric test metrics for analog/RF test techniques requires an accurate multivariate statistical model of output parameters of the device under test, namely performances and test measurements. In this paper, we will use Copulas theory for deriving such a model. A copulas-based model separates the dependencies between these output parameters from their marginal distributions, providing a complete and scale-free description of dependence that is more suitable to be modeled using well known multivariate parametric laws. Previous works have used Gaussian copulas for modeling the dependencies between the output parameters for some types of devices (e.g RF LNA). This paper will illustrate the use of Archimedean copulas for modeling non-Gaussian dependencies. In particular, a Clayton copula will be used to model the dependencies between the output parameters of a case-study test technique for CMOS imagers. Parametric test metrics such as pixel false acceptance and false rejection will be estimated using the derived model.
Keywords :
CMOS image sensors; integrated circuit testing; Archimedean copula; CMOS imager; Clayton copula; Copulas theory; marginal distribution; multivariate parametric law; non-gaussian copula; parametric test metrics estimation; pixel false acceptance; pixel false rejection; scale-free description; Built-in self-test; Estimation; Integrated circuit modeling; Measurement; Monte Carlo methods; Radio frequency; Semiconductor device modeling; Analog test; built-in test; copulas theory; mixed-signal test; statistical modeling; test metrics estimation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW), 2011 IEEE 17th International
Conference_Location :
Santa Barbara, CA
Print_ISBN :
978-1-4577-1144-2
Type :
conf
DOI :
10.1109/IMS3TW.2011.19
Filename :
6132736
Link To Document :
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