DocumentCode :
3054050
Title :
The mechanical and thermal properties of alumina filled epoxy
Author :
Rashid, Erfan Suryani Abdul ; Akil, Hazizan Md ; Ariffin, Kamarshah ; Kooi, Chee Choong
Author_Institution :
Univ. Sains Malaysia, Pulau Pinang
fYear :
2007
fDate :
8-10 Nov. 2007
Firstpage :
282
Lastpage :
287
Abstract :
This article describes the thermal and mechanical behavior of alumina-filled epoxy composites. The epoxy matrix was reinforced with increasing amount of alumina particles in the range of 10-30% by weight using resin transfer molding technique. From the flexural test results, it was observed that the flexural modulus increases with increasing a-alumina content from 10 to 30 wt% with 30 wt% of a-alumina content recorded the highest value of flexural modulus. The DMA result reveals that the highest glass transition temperature (Tg) was recorded at 30 wt% alumina content. It was also found that the 30 wt% alumina content recorded the highest value of storage modulus. The weight loss profile and thermal stability from TGA results show that the thermal stability increases with increasing alumina content. The morphology of the fracture surface also be studied using FESEM.
Keywords :
alumina; composite materials; mechanical properties; scanning electron microscopy; surface morphology; thermal analysis; thermal properties; transfer moulding; Al2O3; DMA; FESEM; TGA; alumina filled epoxy composites; flexural modulus; fracture surface morphology; glass transition temperature; mechanical properties; resin transfer molding; thermal properties; thermal stability; Electronic packaging thermal management; Electronics industry; Electronics packaging; Manufacturing industries; Mechanical factors; Organic materials; Scanning electron microscopy; Testing; Thermal stability; Thermal stresses; DMA; Flexural modulus; TGA; alumina filled epoxy composites;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
ISSN :
1089-8190
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
Type :
conf
DOI :
10.1109/IEMT.2006.4456467
Filename :
4456467
Link To Document :
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