Mold Die Design to Improve Flash Remains for Micro Miniature Package

This paper describes a new mold design which establish a predetermined break point to enhance elimination of excess lead mold flash (MF) on miniature small outline surface mount (SOSM) packages, such as SOD523. Typical lead MF in SOSM packages is commonly found despite many processes to eliminate them for customer satisfaction. SOD523 has been one of the many packages with excess lead MF due to process capability, which at times can lead to customer incidents. This new lead slot design is a combination of triangular and wing type concepts that will eliminate lead MF defects.