Title :
The Solutions of Resistive Ball Bond Failure in Ultra Fine Pitch Wire Bonding
Author :
Ibrahim, Mohd Rusli ; Teck, Siong Chin ; Choi, Yong Cheng
Author_Institution :
Freescale Semicond. Malaysia Sdn. Bhd., Petaling Jaya
Abstract :
In an ultra fine pitch (UFP) wire bonding process, understanding inter-metallic growth and its effect on package reliability are challenging areas. In most cases, eventual resistive ball bond failure is a challenge to the ultra fine pitch packaging. This paper presents an innovative approach to the wire bonding process, tools and material set to enable great performance in reliability packaging. The process also introduces a new, superior 3N gold wire in order to slow down the inter-metallic (IMC) growth to prevent the resistive ball bond failure at earlier stressing stage. A series of evaluations were conducted to establish optimal wire bonding process with good package reliability on different devices. The new material set and process has been proven through production assembly over ten months without any major issues.
Keywords :
gold; integrated circuit bonding; integrated circuit packaging; integrated circuit reliability; 3N gold wire; electronic packaging reliability; intermetallic growth; resistive ball bond failure; ultra fine pitch packaging; ultra fine pitch wire bonding process; Assembly; Bonding processes; Conducting materials; Electronics packaging; Gold; Manufacturing industries; Materials reliability; Semiconductor device manufacture; Semiconductor device packaging; Wire;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456480