A Study and Investigation on Processes Inducing Delamination in QFN Package Using Statistical Analysis

This paper elaborates on the EMC-leadframe interfacial delamination in QFN package. The study was conducted to check each factor and process which contributes to the package delamination. A list of the possible process/factor and their impact on the package interfacial delamination were first determined through brainstorming. Fractional factorial screening experiment was then conducted to determine the vital few factors in the current process flow from the trivial many by incorporating the blocking concept on material batch to batch and machine to machine variation. The screening experiment shows the metal finishing process is the major contributor for delamination. Further each cell in metal finishing process was studied and step by step root cause identification was done. Statistical Analysis was used to determine each affecting factor for delamination. This report discusses the detail DOE to identify the root cause for interfacial delamination.