• DocumentCode
    3054446
  • Title

    2D simulation of gate currents in MOSFETs: Comparison between S-Device and the quantum mechanical simulator GreenSolver

  • Author

    Schenk, Andreas ; Luisier, Mathieu M.

  • Author_Institution
    Integrated Syst. Lab., ETH Zurich, Zurich
  • fYear
    2008
  • fDate
    9-11 Sept. 2008
  • Firstpage
    301
  • Lastpage
    304
  • Abstract
    The gate leakage current caused by direct tunneling in a double-gate n-type MOSFET with a physical gate length of 22 nm is studied. Two approaches are compared: a one-dimensional (1D) Schrodinger-Poisson solver coupled to the common drift-diffusion model and a two-dimensional (2D), full quantum mechanical computation of the current. In the first approach, the tunnel probability through the gate dielectric is obtained on straight lines that connect points in the channel with the gate. The second method uses a 2D Schrodinger-Poisson solver with open boundary conditions where carriers are injected from the source, drain, and gate terminals. The dielectric layer has an equivalent oxide thickness of 1.2 nm and is either composed of pure SiO2 or of a high-K SiOx-HfO2 stack. It is found that the leakage currents calculated with the 2D approach are significantly larger due to diffraction of the electron waves at both edges of the gate contact.
  • Keywords
    MOSFET; Schrodinger equation; dielectric materials; diffusion; hafnium compounds; leakage currents; silicon compounds; SiO2; SiOx-HfO2; dielectric layer; double-gate n-type MOSFET; drift-diffusion model; equivalent oxide thickness; gate currents; gate leakage current; one-dimensional Schrodinger-Poisson solver; quantum mechanical simulator GreenSolver; size 1.2 nm; tunnel probability; Boundary conditions; Computational modeling; Diffraction; High K dielectric materials; High-K gate dielectrics; Leakage current; MOSFETs; Quantum computing; Quantum mechanics; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2008. SISPAD 2008. International Conference on
  • Conference_Location
    Hakone
  • Print_ISBN
    978-1-4244-1753-7
  • Type

    conf

  • DOI
    10.1109/SISPAD.2008.4648297
  • Filename
    4648297