Title :
A Study on Lead Free SnAgCu Solder System
Author :
Jiun, Hoh Huey ; Leng, Eu Poh ; Ding, Min ; Ahmad, Ibrahim
Author_Institution :
Freescale Semicond. (M) Sdn. Bhd., Petaling Jaya
Abstract :
This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and differential scanning calorimetry (DSC) respectively. Overall results indicates that Sn3.8AgO.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8AgO.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.
Keywords :
copper alloys; differential scanning calorimetry; oxidation; shear strength; silver alloys; solders; tin alloys; SnAgCu; differential scanning calorimetry; lead free solder system; low surface oxidation; mechanical properties; shear strength; solder alloy; surface elemental properties; thermal properties; Copper; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Matrices; Mechanical factors; Microstructure; Oxidation; Semiconductor device manufacture; Temperature; Sn-Ag-Cu solder; intermetallic; melting behavior; shear strength;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456493
