DocumentCode :
3054839
Title :
Characterization of Robust Alignment Mark to Improve Alignment Performance
Author :
Ahmad, Normah ; Hashim, Uda ; Manaf, Mohd Jeffery ; Ibrahim, Kader
Author_Institution :
Kolej Univ. Kejuruteraan Utara Malaysia, Kangar
fYear :
2007
fDate :
8-10 Nov. 2007
Firstpage :
518
Lastpage :
523
Abstract :
Overlay requirement is one of the biggest obstacles in achieving a very small feature. With the continued growth of small feature size, overlay requirement becomes tighter. Such a tight requirement requires a very high performance in alignment. Alignment performance is greatly dependent on alignment signal quality. Variation in metal deposition thickness, polishing time, and mark depth may deteriorate the alignment signals quality. In this paper, different types of alignment mark was used to evaluate the alignment performance in various process environment. Based from the findings, two grating alignment mark gives the worst alignment performance, which clearly indicates the unsuitability to use in production environment.
Keywords :
integrated circuit technology; quality control; alignment performance; alignment signal quality; grating alignment mark; metal deposition thickness; overlay requirement; polishing time; production environment; robust alignment mark characterization; Gratings; Manufacturing; Maxwell equations; Microelectronics; Numerical analysis; Production; Robustness; Signal generators; Signal processing; Silicon; Alignment; Alignment Mark; Alignment Performance; Alignment Signal; Overlay;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
ISSN :
1089-8190
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
Type :
conf
DOI :
10.1109/IEMT.2006.4456505
Filename :
4456505
Link To Document :
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