Abstract :
On behalf of the Organizing and Technical Committees, it is our pleasure to welcome you to the fifth international conference on ??Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems?? (EuroSimE2004) held at the Novotel Tour Noire, Brussels, Belgium, May 10 - 12, 2004.
Keywords :
Analytical models; Components, Packaging, and Manufacturing Technology Society; Conference proceedings; Continents; Microelectronics; Organizing; Software tools; Thermomechanical processes;
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location :
Brussels, Belgium
Print_ISBN :
0-7803-8420-2
DOI :
10.1109/ESIME.2004.1304007
