Advantages & Challenges of Cold Ball Pull Test vs Conventional Ball Shear Test in the Assessment of Lead-free Solder Joint Performance

Author

Leng, Eu Poh ; Ding, Min ; Jiun, Hoh Huey ; Ahmad, Ibrahim ; Hazlinda, Kamarudin

Author_Institution

Freescale Semicond., Petaling Jaya

fYear

2007

fDate

8-10 Nov. 2007

Firstpage

534

Lastpage

540

Abstract

A comparison study was done between cold ball pull (CBP) test vs. the conventional ball shear test to further understand the advantages & challenges of CBP test as a method to assess lead-free solder joint performance. From this study, CBP was found to be a better and preferred tool that is able to identify poor lead free solder joint and hence to differentiate the performance of lead free solder systems. This study also outlined the challenges of implementing CBP test as a standard monitoring tool in production floor which lead to the usage of CBP test merely as an engineering monitoring tool at this point.

Keywords

materials testing; shear strength; solders; CBP test; ball shear test; cold ball pull test; lead free solder systems; lead-free solder joint performance; Electronic equipment testing; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Lead compounds; Monitoring; Production; Semiconductor device manufacture; Semiconductor device testing; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing and Technology, 31st International Conference on

Conference_Location

Petaling Jaya

ISSN

1089-8190

Print_ISBN

978-1-4244-0730-9

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2006.4456508

Filename

4456508