Title :
Advantages & Challenges of Cold Ball Pull Test vs Conventional Ball Shear Test in the Assessment of Lead-free Solder Joint Performance
Author :
Leng, Eu Poh ; Ding, Min ; Jiun, Hoh Huey ; Ahmad, Ibrahim ; Hazlinda, Kamarudin
Author_Institution :
Freescale Semicond., Petaling Jaya
Abstract :
A comparison study was done between cold ball pull (CBP) test vs. the conventional ball shear test to further understand the advantages & challenges of CBP test as a method to assess lead-free solder joint performance. From this study, CBP was found to be a better and preferred tool that is able to identify poor lead free solder joint and hence to differentiate the performance of lead free solder systems. This study also outlined the challenges of implementing CBP test as a standard monitoring tool in production floor which lead to the usage of CBP test merely as an engineering monitoring tool at this point.
Keywords :
materials testing; shear strength; solders; CBP test; ball shear test; cold ball pull test; lead free solder systems; lead-free solder joint performance; Electronic equipment testing; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Lead compounds; Monitoring; Production; Semiconductor device manufacture; Semiconductor device testing; Soldering;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456508
