Trends & challenges in microsystems packaging

Summary form only given. Current and future microsystems require a set of fundamental technologies that include microelectronics, photonics, MEMS, biological and wireless functions. For these functions to be integrated into systems they have to be designed, fabricated, assembled, tested and reliability assured which means they have to be packaged at the system level. This talk addresses some of the trends and key challenges for tomorrow´s microsystems and how the microsystems technologies form the drivers of this information age. Research challenges pertinent to design, modeling and simulation, materials and assembly are also covered.