Title :
3D microwave modules for space applications
Author :
Monfraix, P. ; Ulian, P. ; Drevon, C. ; George, S. ; Vera, A.C. ; Tronche, C. ; Cazaux, J.L. ; Llopis, O. ; Graffeuil, J.
Author_Institution :
Alcatel Espace, Toulouse, France
Abstract :
This paper describes the design, manufacturing and measurement of 3D microwave modules. The vertical interconnection between stacked circuits is based on an shielded homogeneous coplanar line with a 90/spl deg/ vertical structure. The fabrication of these modules is in relation with the "MultiChip Module Vertical" technology, originally developed for digital applications. The electrical measurement in the Ku-band demonstrates very good results.
Keywords :
aerospace; microwave circuits; modules; packaging; 3D microwave modules; Ku-band; fabrication; manufacturing; shielded homogeneous coplanar line; space applications; stacked circuits; vertical interconnection; Dielectric substrates; Extraterrestrial measurements; Frequency; Integrated circuit interconnections; Microwave devices; Microwave measurements; Microwave technology; Performance evaluation; Pulp manufacturing; Stacking;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.700610
