An embedded transmission line micro-ball grid array X-band power amplifier

Author

Budka, T. ; Stiborek, L. ; Heinrich, L. ; Kyhl, C.

Author_Institution

R&D, M/A-COM Corp., Lowell, MA, USA

Volume

3

fYear

1998

fDate

7-12 June 1998

Firstpage

1293

Abstract

This paper describes an electronic packaging topology using embedded transmission line (ETL) monolithic microwave integrated circuits (MMIC) that have been flip-chip mounted on a beryllia (BeO) micro-ball grid array (/spl mu/BGA) ceramic carrier with a z-axis interconnect material. Small signal S-parameters are presented at each stage during the assembly process and negligible frequency shifts are observed due to the flip-chip packaging before and after encapsulation. Increased gains of 2.0 dB with the unencapsulated and 2.2 dB with the encapsulated packaged part are observed compared to the on-wafer measurements at 10 GHz under the same bias conditions.

Keywords

MMIC power amplifiers; S-parameters; flip-chip devices; integrated circuit packaging; 10 GHz; BeO; BeO ceramic carrier; MMIC; X-band; ball grid array; electronic packaging topology; embedded transmission line micro-BGA; flip-chip mounting; monolithic microwave integrated circuits; power amplifier; small signal S-parameters; z-axis interconnect material; Ceramics; Circuit topology; Distributed parameter circuits; Electronics packaging; Integrated circuit interconnections; MMICs; Microwave antenna arrays; Microwave integrated circuits; Monolithic integrated circuits; Power transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1998 IEEE MTT-S International

Conference_Location

Baltimore, MD, USA

ISSN

0149-645X

Print_ISBN

0-7803-4471-5

Type

conf

DOI

10.1109/MWSYM.1998.700611

Filename

700611