Automated FEM mesh optimization for nonlinear problems based on error estimation [IC packaging applications]

Author

Rzepka, Sven

Author_Institution

Infineon Technol. SC300 Dresden GmbH & Co. KG, Germany

fYear

2004

fDate

2004

Firstpage

201

Lastpage

209

Abstract

Applying the fundamental work of Zienkiewicz and Boroomand, this paper introduces a methodology for automated mesh optimization based on estimates of the discretization error. The objective of this effort has been the use of the methodology with a commercial FEM code (ANSYS^TM) and its application to thermal stress analyses of flip chip modules (FC) and chip size packages (CSP) with solder joints, which means the presence of nonlinear material models (plasticity and creep).

Keywords

chip scale packaging; creep; flip-chip devices; integrated circuit modelling; mesh generation; plasticity; thermal analysis; thermal stresses; CSP; IC packaging; automated FEM mesh optimization; chip size packages; creep; discretization error estimation; flip chip modules; mesh density; nonlinear material models; nonlinear problems; plasticity; solder joints; thermal stress analysis; Chip scale packaging; Creep; Error analysis; Flip chip; Integrated circuit packaging; Joining materials; Optimization methods; Plastic packaging; Soldering; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on

Print_ISBN

0-7803-8420-2

Type

conf

DOI

10.1109/ESIME.2004.1304041

Filename

1304041