Application of simulation-based decision making in product development of an RF module [automotive MCM]

This paper presents results of simulation-based design evaluation for thermal and thermo-mechanical performance and cost of packaging technology of an RF module for automotive applications. A combination of thermal, thermo-mechanical and cost analysis within the multi-attribute decision making framework enabled design ranking and revealed two MCM-L/D (multi-chip module-laminate/deposition) and MCM-D (deposition) designs with the wire bonding assembly preferred for use in automotive applications for different temperature environments. Simulation-based design guidelines were developed for designing electronic modules exhibiting good thermal and thermo-mechanical performance. By application-based partitioning of the importance weights assigned to the reliability and cost criteria, the guidelines were extended to cover other application areas.