DocumentCode :
3055954
Title :
[Blank page]
fYear :
2004
fDate :
10-12 May 2004
Firstpage :
322
Lastpage :
327
Abstract :
This page or pages intentionally left blank.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location :
Brussels, Belgium
Print_ISBN :
0-7803-8420-2
Type :
conf
DOI :
10.1109/ESIME.2004.1304058
Filename :
1304058
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3055954