DocumentCode :
3055984
Title :
Mechanism-based delamination prediction during reflow with moisture preconditioning
Author :
Fan, Xuejun ; Zhang, G.Q. ; van Driel, W. ; Ernst, L.J.
Author_Institution :
Philips Res. USA, Briarcliff Manor, NY, USA
fYear :
2004
fDate :
2004
Firstpage :
329
Lastpage :
335
Abstract :
In this paper, a vapor pressure model, based on a micromechanics approach, is introduced first, with which the moisture absorption and porosity of the material, and the temperature can be connected. Then the neo-Hookean model is used to describe the finite-deformation of rubberlike plastic materials at higher temperature. It has been observed that the vapor pressure has almost negligible impact on the material behavior in bulk. However, with the implementation of interface properties into the model study, it shows that the critical stress that results in the unstable void growth and delamination at the interface is significantly reduced and becomes comparable to the magnitude of the vapor pressure. A framework of the description of void-growth at the interface is postulated.
Keywords :
deformation; delamination; electronics packaging; failure analysis; internal stresses; moisture control; porosity; printed circuit manufacture; reflow soldering; vapour pressure; voids (solid); catastrophic failure mechanism; critical stress; interface delamination; interface void growth; interfacial stresses; material porosity; mechanism-based delamination prediction; microelectronic packaging; moisture absorption; moisture preconditioning; neo-Hookean model; reflow soldering; rubber-like plastic material finite-deformation; vapor pressure model; vapor-pressure induced void initiation; void coalescence; Absorption; Delamination; Electronic packaging thermal management; Humidity control; Microelectronics; Moisture; Plastics; Polymer films; Printed circuits; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Print_ISBN :
0-7803-8420-2
Type :
conf
DOI :
10.1109/ESIME.2004.1304059
Filename :
1304059
Link To Document :
بازگشت