Tri-dimensional reduced-order thermal model of stacked electronic structures

Author

Feuillet, V. ; Gatto, V. ; Scudeller, Y. ; Jarny, Y.

Author_Institution

Lab. de Thermocinetique, Ecole polytechnique de l´´universite de Nantes, France

fYear

2004

fDate

2004

Firstpage

423

Lastpage

428

Abstract

This paper deals with the development of a reduced-order thermal modelling based on the analysis of heat spreading occurring in an element where a heat source is attached. The modelling, suitable for any stacked electronic structures, uses the elementary solution of the tri-dimensional heat conduction equation. The reduced-order thermal model is applied to the thermal design of an RF power component.

Keywords

cooling; heat conduction; heat sinks; integrated circuit modelling; integrated circuit packaging; power semiconductor devices; reduced order systems; semiconductor device models; semiconductor device packaging; thermal analysis; thermal management (packaging); RF power component; heat source; heat spreading; stacked electronic structures; thermal design; tri-dimensional heat conduction equation; tri-dimensional reduced-order thermal model; Conducting materials; Electronic packaging thermal management; Equations; Heat sinks; Radio frequency; Resistance heating; Semiconductor materials; Substrates; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on

Print_ISBN

0-7803-8420-2

Type

conf

DOI

10.1109/ESIME.2004.1304073

Filename

1304073