DocumentCode :
3056466
Title :
Modeling heat transfer and liquid flow in micro-channels
Author :
Sabry, M.N. ; Djebedjian, B.O. ; Saleh, S.H. ; Mahgoub, M.M.
Author_Institution :
Univ. Franqaise d´´Egypte, Cairo, Egypt
fYear :
2004
fDate :
2004
Firstpage :
511
Lastpage :
518
Abstract :
The use of micro-channels in order to cool modern high speed electronic circuits is one of the techniques frequently adopted in current practice. A burst of publications in this area has been observed in the last decade. However, modeling of fluid flow and heat transfer in micro-channels is still an open problem. In fact, many deviations have been experimentally observed between well established correlations used for conventional normally sized channels and the behavior of microchannels. These deviations increase as the channel size decreases. In this work, observed experimental deviations are first listed, followed by a critical review of different hypotheses advanced in the literature to explain them. One of these hypotheses is thoroughly developed in order to build a model that explains both the orders of magnitudes and the trends of observed phenomena.
Keywords :
channel flow; circuit simulation; cooling; flow simulation; high-speed integrated circuits; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; thermal analysis; thermal management (packaging); channel size; fluid flow; heat transfer modeling; high speed electronic circuits cooling; liquid flow modeling; micro-channels; Chemical technology; Circuits; Fluid flow; Friction; Heat transfer; Hydraulic diameter; Modems; Shape; Temperature; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Print_ISBN :
0-7803-8420-2
Type :
conf
DOI :
10.1109/ESIME.2004.1304085
Filename :
1304085
Link To Document :
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