Cooling problems and thermal issues in high power electronics - a multi faceted design approach

Author

Behnia, Masud ; Maguire, Luke ; Morrison, Graham

Author_Institution

Sydney Univ., NSW, Australia

fYear

2004

fDate

2004

Firstpage

519

Lastpage

526

Abstract

This paper provides a review of some of the issues currently facing thermal designers of high power electronics. With the current market resistance to widely embrace advanced methods such as liquid cooling, air cooling will continue to be a popular choice (K. Azar, 8th THERMINIC workshop, 2002). As heat loads increase and system sizes reduce, further innovation and optimisation of system level air cooling design will need to continue. Selected case studies are presented to illustrate the range of design tools currently available and to highlight the need for an integrated approach to meet future cooling demands.

Keywords

cooling; electronic design automation; integrated circuit design; integrated circuit packaging; optimisation; power integrated circuits; power semiconductor devices; thermal management (packaging); air cooling; cooling problems; design tools; heat loads; high power electronics; liquid cooling; multi faceted design; system level air cooling design; system sizes; thermal design; thermal issues; Australia; Computational fluid dynamics; Electronic packaging thermal management; Electronics cooling; Liquid cooling; Power electronics; Predictive models; Switches; Temperature; Trigeneration;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on

Print_ISBN

0-7803-8420-2

Type

conf

DOI

10.1109/ESIME.2004.1304086

Filename

1304086