Microstructural behaviour of solder alloys

Author

Ubachs, R.L.J.M. ; Schreurs, P.J.G. ; Geers, M.G.D.

Author_Institution

Dept. of Mech. Eng., Eindhoven Univ. of Technol., Netherlands

fYear

2004

fDate

2004

Firstpage

543

Lastpage

547

Abstract

In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The material parameters are taken dependent on the mass fraction field which is calculated with the diffuse interface model. This results in a microstructure dependent material model which takes into account the size, orientation, and distribution of the individual phase regions.

Keywords

crystal microstructure; elastoplasticity; electronics packaging; interface structure; solders; thermal stresses; viscoplasticity; diffuse interface model; hyperelasto-viscoplastic Perzyna model; mass fraction field; material parameters; mechanical behaviour; microstructural behaviour; microstructure dependent material model; microstructure evolution; multiphase solder alloy; nonlocal diffuse interface theory; phase region distribution; phase region orientation; phase region size; solder alloys; Creep; Fatigue; Life estimation; Microstructure; Soldering; Temperature; Testing; Thermal expansion; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on

Print_ISBN

0-7803-8420-2

Type

conf

DOI

10.1109/ESIME.2004.1304089

Filename

1304089