DocumentCode :
3056634
Title :
Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages
Author :
Vandevelde, B. ; Gonzalez, M. ; Limaye, P. ; Ratchev, P. ; Beyne, E.
Author_Institution :
IMEC
fYear :
2004
fDate :
10-12 May 2004
Firstpage :
565
Lastpage :
570
Abstract :
This paper deals with a comparison study between SnPb and SnAgCu solder joint reliability. The comparison is based on non-linear finite element modellin. Three packages have been selected: silicon CSP, underfilled flip chip and QFN package. Also the effect of thermal cycling conditions has been investigated. Comparing the induced inelastic strains in the solder joint, the leadfree SnAgCu generally scores better thanks to the lower creep strain rate. On the other hand for the CSP and flip chip package, SnAgCu scores worse for the more extreme loading conditions when the inelastic dissipated energy density is selected as damage parameter. The main reason is that due to the lower creep strain rate, the stresses become higher for SnAgCu resulting in higher hysteresis loops with more dissipated energy per cycle. For the QFN package, SnAgCu scores much better.
Keywords :
Capacitive sensors; Chip scale packaging; Creep; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Flip chip; Lead; Soldering; Stress; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location :
Brussels, Belgium
Print_ISBN :
0-7803-8420-2
Type :
conf
DOI :
10.1109/ESIME.2004.1304092
Filename :
1304092
Link To Document :
بازگشت