DocumentCode :
3056685
Title :
Molecular simulation of cu-sam adhesion force
Author :
Haibo Fan ; Wong, C.K.Y. ; Yuen, M.M.F.
Author_Institution :
Hong Kong University of Science and Technology
fYear :
2004
fDate :
10-12 May 2004
Firstpage :
575
Lastpage :
579
Abstract :
The interface of Copper-EMC (Epoxy Molding Compound) is known to be the weakest joint in the electronic package design, which causes delamination during reliability test. A prime reason is the poor adhesion between Cu and epoxy compound. To solve the problem, We have used self-assembly monolayer (SAM) to improve adhesion of copper-epoxy system. This paper focuses on simulation of adhesion in Cu-SAM system. In this study, molecular models of bi-material system, which consists of SAM and Cu, were built to evaluate adhesion force of the Cu-SAM system. In order to dramatically reduce the computational time, only the copper tip and SAM substrate were modeled with a limited number of atoms. After energy minimization of the whole structure, tensile stresses were applied to the whole structure to simulate the debonding process, and the ultimate stress was obtained when the two materials delaminates completely. The adhesion force between the copper tip and the SAM can be evaluated from the ultimate tensile stress. The molecular model results were compared with AFM results in which adhesion force between Cu tip and SAM coated copper substrate were measured. Two different types of SAM material were used in this study. The paper intended to relate closely adhesion by using MD simulation, and the underlying physics for the explanation to the adhesion phenomenon for further understanding of failure mechanism of interfacial delamination.
Keywords :
Adhesives; Atomic force microscopy; Computational modeling; Copper; Delamination; Electronics packaging; Rough surfaces; Self-assembly; Surface roughness; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location :
Brussels, Belgium
Print_ISBN :
0-7803-8420-2
Type :
conf
DOI :
10.1109/ESIME.2004.1304094
Filename :
1304094
Link To Document :
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