DocumentCode :
3058796
Title :
UV Lithographic Patterning on Spin-coated DNA Thin-films
Author :
Diggs, D.E. ; Grote, J.G. ; Bartsch, Christian ; Ouchen, F. ; Sharma, Anup ; Taguenang, J.M. ; Kassu, Aschalew ; Sileshi, R.
Author_Institution :
Air Force Res. Lab., Wright-Patterson Air Force Base, Dayton, OH
fYear :
2008
fDate :
16-18 July 2008
Firstpage :
97
Lastpage :
101
Abstract :
Photopatterning with 266 nm UV light was accomplished on spin-coated DNA thin films using two different techniques. Lithographic masks were used to create 10-100 micron-sized arrays of enhanced hydrophilicity. Two such masks were used: (1) Polka Dot Filter having opaque squares and a transparent grid and (2) A metal wire-mesh having transparent squares and opaque grid. UV light selectively photodissociates the DNA film where it is exposed into smaller more hydrophilic fragments. UV-exposed films are then coated with a solution of a protein. The protein appears to selectively coat over areas exposed to UV light. We have also used interferometric lithography with UV light to accomplish patterning on the scale of 1 micron on DNA thin films. This technique has the potential to generate micro/nano arrays and vary the array-size. This paper describes the fabrication of these microarrays and a plausible application for fabricating antibody arrays for protein sensing applications.
Keywords :
DNA; biosensors; hydrophilicity; molecular biophysics; nanolithography; nanopatterning; photodissociation; photolithography; proteins; UV lithographic patterning; hydrophilicity; interferometric lithography; metal wire-mesh; microarrays; photodissociation; photopatterning; polka dot filter; protein sensing applications; size 10 micron to 100 micron; spin-coated DNA thin films; wavelength 266 nm; Biological materials; Conducting materials; DNA; Lithography; Nonlinear optics; Optical devices; Optical sensors; Polymers; Proteins; Thin films; DNA; UV lithography; microarrays; protein sensing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace and Electronics Conference, 2008. NAECON 2008. IEEE National
Conference_Location :
Dayton, OH
ISSN :
7964-0977
Print_ISBN :
978-1-4244-2615-7
Electronic_ISBN :
7964-0977
Type :
conf
DOI :
10.1109/NAECON.2008.4806525
Filename :
4806525
Link To Document :
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