DocumentCode
3059660
Title
Fatigue behavior and effect of crack propagation in lead free solder in microelectronic packaging
Author
Paradee, Gary ; Christou, Aris
Author_Institution
Dept. of Mater. Sci. & Eng., Univ. of Maryland, College Park, MD, USA
fYear
2009
fDate
9-11 Dec. 2009
Firstpage
1
Lastpage
2
Abstract
We have observed stress softening behavior of SAC 305 bulk solder bars tested at various stress levels and frequencies at room temperature. The behavior can be described by crack propagation through these as well as microstructural interactions within the material. Continued testing at other stress levels and temperatures will be conducted to further understand low cycle fatigue in SAC 305 to eventually improve the reliability of devices using SAC 305.
Keywords
cracks; integrated circuit packaging; solders; SAC 305 bulk solder bars; crack propagation; lead free solder; microelectronic packaging; stress softening; Bars; Environmentally friendly manufacturing techniques; Fatigue; Lead; Microelectronics; Packaging; Softening; Stress; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2009. ISDRS '09. International
Conference_Location
College Park, MD
Print_ISBN
978-1-4244-6030-4
Electronic_ISBN
978-1-4244-6031-1
Type
conf
DOI
10.1109/ISDRS.2009.5378270
Filename
5378270
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