• DocumentCode
    3062054
  • Title

    A real-time virtual integration environment for the design and development of neural prosthetic systems

  • Author

    Bishop, William ; Armiger, Robert ; Burck, James ; Bridges, Michael ; Hauschild, Markus ; Englehart, Kevin ; Scheme, Erik ; Vogelstein, R. Jacob ; Beaty, James ; Harshbarger, Stuart

  • Author_Institution
    The Johns Hopkins University Applied Physics Laboratory, Laurel, MD, USA
  • fYear
    2008
  • fDate
    20-25 Aug. 2008
  • Firstpage
    615
  • Lastpage
    619
  • Abstract
    We have developed a virtual integration environment (VIE) for the development of neural prosthetic systems. The VIE is a software environment that modularizes the core functions of a neural prosthetic system — receiving signals, decoding signals and controlling a real or simulated device. Complete prosthetic systems can be quickly assembled by linking pre-existing modules together through standard interfaces. Systems can be simulated in real-time, and simulated components can be swapped out for real hardware. This paper is the first of two companion papers that describe the VIE and its use. In this paper, we first describe the architecture of the VIE and review implemented modules. We then describe the use of the VIE for the real-time validation of neural decode algorithms from pre-recorded data, the use of the VIE in closed loop primate experiments and the use of the VIE in the clinic.
  • Keywords
    Assembly systems; Biomedical engineering; Decoding; Hardware; Jacobian matrices; Joining processes; Neural prosthesis; Physics; Prosthetics; Real time systems; Computer Systems; Equipment Design; Equipment Failure Analysis; Man-Machine Systems; Nervous System Diseases; Prostheses and Implants; Reproducibility of Results; Sensitivity and Specificity; Therapy, Computer-Assisted; User-Computer Interface;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-1814-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2008.4649228
  • Filename
    4649228