DocumentCode
3062054
Title
A real-time virtual integration environment for the design and development of neural prosthetic systems
Author
Bishop, William ; Armiger, Robert ; Burck, James ; Bridges, Michael ; Hauschild, Markus ; Englehart, Kevin ; Scheme, Erik ; Vogelstein, R. Jacob ; Beaty, James ; Harshbarger, Stuart
Author_Institution
The Johns Hopkins University Applied Physics Laboratory, Laurel, MD, USA
fYear
2008
fDate
20-25 Aug. 2008
Firstpage
615
Lastpage
619
Abstract
We have developed a virtual integration environment (VIE) for the development of neural prosthetic systems. The VIE is a software environment that modularizes the core functions of a neural prosthetic system — receiving signals, decoding signals and controlling a real or simulated device. Complete prosthetic systems can be quickly assembled by linking pre-existing modules together through standard interfaces. Systems can be simulated in real-time, and simulated components can be swapped out for real hardware. This paper is the first of two companion papers that describe the VIE and its use. In this paper, we first describe the architecture of the VIE and review implemented modules. We then describe the use of the VIE for the real-time validation of neural decode algorithms from pre-recorded data, the use of the VIE in closed loop primate experiments and the use of the VIE in the clinic.
Keywords
Assembly systems; Biomedical engineering; Decoding; Hardware; Jacobian matrices; Joining processes; Neural prosthesis; Physics; Prosthetics; Real time systems; Computer Systems; Equipment Design; Equipment Failure Analysis; Man-Machine Systems; Nervous System Diseases; Prostheses and Implants; Reproducibility of Results; Sensitivity and Specificity; Therapy, Computer-Assisted; User-Computer Interface;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
Conference_Location
Vancouver, BC
ISSN
1557-170X
Print_ISBN
978-1-4244-1814-5
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2008.4649228
Filename
4649228
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