DocumentCode
3062343
Title
Area-Per-Yield and Defect Level of Cascaded TMR for Pipelined Processors
Author
Arai, Masayuki ; Iwasaki, Kazuhiko
Author_Institution
Fac. of Syst. Design, Tokyo Metropolitan Univ., Tokyo, Japan
fYear
2011
fDate
12-14 Dec. 2011
Firstpage
264
Lastpage
271
Abstract
In this paper we evaluate the effectiveness of cascaded triple modular redundancy (TMR) in terms of area-per-yield and defect level by applying to every stage of a pipelined processor. Considering a cascade of nine possible TMR stage architectures, we theoretically derive the area-per-yield on the basis of the given parameters of defect density and the number of stages. Also, assuming that a production test is independently applied for each module and voter in every stage and the pass/fail of a chip is determined on the basis of the test result, we theoretically derive the defect level for the given fault coverage. Numerical examples show that the application of cascaded TMR improves the area-per-yield and the defect level when manufacturing yield is low. In addition, some cases exist in which the number of stages minimize the area-per-yield or the defect level.
Keywords
fault diagnosis; manufacturing processes; pipeline processing; redundancy; system-on-chip; TMR stage architecture; area-per-yield; cascaded TMR defect level; cascaded triple modular redundancy; fault coverage; manufacturing yield; pipelined processor; production test; Equations; Production; Program processors; Reliability; Silicon; System-on-a-chip; Tunneling magnetoresistance; area-per-yield; cascaded TMR; defect level; test escape;
fLanguage
English
Publisher
ieee
Conference_Titel
Dependable Computing (PRDC), 2011 IEEE 17th Pacific Rim International Symposium on
Conference_Location
Pasadena, CA
Print_ISBN
978-1-4577-2005-5
Electronic_ISBN
978-0-7695-4590-5
Type
conf
DOI
10.1109/PRDC.2011.38
Filename
6133088
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