Current status of 300 mm/0.25-0.18 μm technologies

Since November 1996, Selete has evaluated more than 20 pieces of equipment for 300 mm wafer processes from FEOL to BEOL. According to Selete´s evaluation plan, the middle of 2000 is predicted as the start-up for the first volume production using 300 mm wafers. In order to ensure productivity of equipment and processes, Selete has made specifications to meet the requirements for fabrication of device structures down to 0.18 μm technology. These specifications have been validated by electrical evaluation and marathon testing. Selete´s program for 300 mm equipment and materials will continue until March 2000 and will evaluate about 70 pieces of equipment. More than two pieces of equipment will be evaluated for each unit process