DocumentCode
3062566
Title
VLSI process integration
Author
Wong, Catherine Y. ; Chan, Mansun
Author_Institution
Hong Kong Univ. of Sci. & Technol., Clear Water Bay, Hong Kong
fYear
1998
fDate
1998
Firstpage
36
Lastpage
39
Abstract
It has been predicted that microprocessors will use over 13 million transistors by year 2001 and that by year 2010, over 90 million transistors will he deployed to fabricate semiconductor chips with ever increasing efficiency. It has also been generally accepted that the costs of a wafer fab essentially double for each new generation of microprocessor. In the coming 21st Century, VLSI process integration, in product/research/development and in manufacturing, will need to meet the demands of not only the technology innovations, the reliability and scaling challenges, but also the cost effectiveness of yield, factory workflow and capacity management. Issues addressing these factors, sometimes leading in diametric directions, and the novel solutions, are presented and discussed
Keywords
VLSI; integrated circuit manufacture; lithography; silicon-on-insulator; SOI technology; VLSI process integration; factory workflow management; manufacturing; reliability; scaling; semiconductor chips; wafer fab costs; Costs; Innovation management; Manufacturing processes; Microprocessors; Production facilities; Research and development management; Semiconductor device manufacture; Technological innovation; Technology management; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785779
Filename
785779
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