• DocumentCode
    3062566
  • Title

    VLSI process integration

  • Author

    Wong, Catherine Y. ; Chan, Mansun

  • Author_Institution
    Hong Kong Univ. of Sci. & Technol., Clear Water Bay, Hong Kong
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    36
  • Lastpage
    39
  • Abstract
    It has been predicted that microprocessors will use over 13 million transistors by year 2001 and that by year 2010, over 90 million transistors will he deployed to fabricate semiconductor chips with ever increasing efficiency. It has also been generally accepted that the costs of a wafer fab essentially double for each new generation of microprocessor. In the coming 21st Century, VLSI process integration, in product/research/development and in manufacturing, will need to meet the demands of not only the technology innovations, the reliability and scaling challenges, but also the cost effectiveness of yield, factory workflow and capacity management. Issues addressing these factors, sometimes leading in diametric directions, and the novel solutions, are presented and discussed
  • Keywords
    VLSI; integrated circuit manufacture; lithography; silicon-on-insulator; SOI technology; VLSI process integration; factory workflow management; manufacturing; reliability; scaling; semiconductor chips; wafer fab costs; Costs; Innovation management; Manufacturing processes; Microprocessors; Production facilities; Research and development management; Semiconductor device manufacture; Technological innovation; Technology management; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4306-9
  • Type

    conf

  • DOI
    10.1109/ICSICT.1998.785779
  • Filename
    785779