DocumentCode :
3062990
Title :
The resistance characteristics of the Ni-Cr thin films and their influence on the integrated circuits
Author :
Zhao, Lixin ; Shen, Guangdi ; Gao, Guo ; Xu, Chen ; Du, Jinyu ; Zou, Deshu ; Chen, Jianxin
Author_Institution :
Dept. of Electron. Eng., Beijing Polytech. Univ., China
fYear :
1998
fDate :
1998
Firstpage :
123
Lastpage :
126
Abstract :
Ni-Cr thin films with different thicknesses have been fabricated on the dielectric substrate silicon dioxide (SiO2) by using magnetron sputtering and vacuum evaporation and annealed at different temperatures. The sheet resistance and the strip line microwave impedance of the Ni-Cr thin film are measured. The results show that they are influenced strongly by the thickness and the annealing temperature. These problems are analyzed in detail including the effects of the carrier tunnel transport, the oxidation, the condensation and the stabilization in the thin film
Keywords :
annealing; chromium alloys; electrical resistivity; high-frequency effects; integrated circuit interconnections; metallic thin films; nickel alloys; oxidation; sputtered coatings; tunnelling; vacuum deposited coatings; Ni-Cr; Ni-Cr thin films; SiO2; annealing temperature; carrier tunnel transport; condensation; dielectric substrate; integrated circuits; magnetron sputtering; oxidation; resistance characteristics; sheet resistance; silicon dioxide; stabilization; strip line microwave impedance; vacuum evaporation; Annealing; Dielectric substrates; Dielectric thin films; Impedance; Semiconductor thin films; Silicon compounds; Sputtering; Strips; Temperature; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
Type :
conf
DOI :
10.1109/ICSICT.1998.785817
Filename :
785817
Link To Document :
بازگشت