DocumentCode :
3063008
Title :
Investigation of KOH anisotropic etching of Si <100> wafers for improving etched surface quality
Author :
Wei, Wang ; Xiaowei, Liu ; Xilian, Wang ; Yuqiang, Liu ; Maojun, Fan
Author_Institution :
Microelectron. Center, Harbin Inst. of Technol., China
fYear :
1998
fDate :
1998
Firstpage :
127
Lastpage :
130
Abstract :
The main influences of KOH anisotropic etching of Si ⟨100⟩ wafers on etched surface flatness are investigated experimentally. In the Si membrane etching with Si3N4 mask, the Si3N4 etching and the sediments in KOH aqueous solution are found as the main influences. The effective method to improve surface quality is presented by the mechanism analysis
Keywords :
elemental semiconductors; etching; masks; silicon; surface topography; KOH; KOH anisotropic etching; KOH aqueous solution; Si; Si ⟨100⟩ wafers; Si membrane; Si3N4; Si3N4 mask; etched surface quality; sediments; surface flatness; Anisotropic magnetoresistance; Biomembranes; Etching; History; Micromachining; Microsensors; Sediments; Silicon; Stress; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
Type :
conf
DOI :
10.1109/ICSICT.1998.785819
Filename :
785819
Link To Document :
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