Title :
An advanced hybrid assembly technique for 40 Gbit/s-modules including surface and feed-through capacitors
Author :
Hanke, G. ; Nohr, W. ; Weber, D.
Author_Institution :
Deutsche Telecom AG, Darmstadt, Germany
Abstract :
Experimental 40 Gbit/s ETDM transmitter and receiver modules for optical fiberlink applications were developed. To obtain the essential extreme broad bandwidth the GaAs-chips are connected by self-supporting leads to ceramic thin film circuits which shows nearly reflection- and discontinuity-free connections up to millimeter-wave frequencies. In addition the use of hybrid integrated surface and coaxial feed-through capacitors results in low impedances and ultra broadband bypasses.
Keywords :
III-V semiconductors; capacitors; gallium arsenide; hybrid integrated circuits; microassembling; millimetre wave integrated circuits; optical fibre communication; optical receivers; optical transmitters; time division multiplexing; 40 Gbit/s; ETDM; GaAs; GaAs chip; ceramic thin film circuit; coaxial feed-through capacitor; hybrid assembly; millimeter-wave frequency; optical fiber link; receiver module; self-supporting lead; surface capacitor; transmitter module; Assembly; Bandwidth; Ceramics; Millimeter wave integrated circuits; Optical fibers; Optical films; Optical receivers; Optical transmitters; Thin film circuits; Ultraviolet sources;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.700708
