Title :
Wire bonding technique for high temperature applications
Author :
Freytag, Jürgen ; Wennemuth, Ingo
Author_Institution :
Res. & Technol., Daimler-Benz AG, Frankfurt, Germany
Abstract :
Palladium (Pd) wire is a favourable metal for wire bonding electronic devices operating an enhanced temperatures. The bonding process was investigated and the significant process parameters were identified. Different parameter sets were worked out for various bonding machines. The separation of the wire after the bonding process was found to be decisive for the quality of the bond. Thermal ageing at enhanced temperatures (i.e. 300°C for 1000 h) causes no degradation of the bonds
Keywords :
adhesion; ageing; high-temperature effects; lead bonding; metallisation; palladium; 1000 h; 300 C; Pd wire; Pd-Si; Si; bonds; high temperature applications; metal; palladium wire; process parameters; thermal ageing; wire bonding technique; Aging; Artificial intelligence; Atmosphere; Bonding forces; Bonding processes; Furnaces; Gold; Materials reliability; Temperature; Wire;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785858
