Title :
The effect of stress and kinetic reaction barriers on the reactive growth of nanometer-sized epitaxial NiSi2 islands on Si(111)
Author :
Hesse, D. ; Mattheis, R. ; Werner, P.
Author_Institution :
Max-Planck-Inst. fur Mikrostructurphys., Halle, Germany
Abstract :
Growth kinetics and interface structures of epitaxial, nanometer-sized NiSi2 islands of A- and B-orientations on Si(111) single-crystal substrates are studied by RBS, TEM/SAED, and high-resolution TEM on cross sections. The islands grow by an in situ solid state reaction between the silicon substrate and a nickel vapour at temperatures of 300°C and 400°C. Owing to a crossover of the thermal expansion curves of NiSi2 and Si at 400°C, stresses determine the shares of (three-dimensional) A-islands and (two-dimensional) B-islands at different temperatures. Furthermore, A-islands contain dislocations, whereas B-islands are completely free from lattice defects, with the exception of interfacial steps of various heights occurring at the NiSi2/Si(111) growth fronts of both island types. These steps play an essential role in the island growth. The difference in the reaction kinetics observed between A- and B-islands at 400°C is explained in terms of different kinetic reaction barriers present at the structurally different NiSi2Si(111) growth fronts under the A-and B-islands
Keywords :
Rutherford backscattering; diffusion barriers; dislocations; electron diffraction; elemental semiconductors; interface structure; metallic epitaxial layers; nanostructured materials; nickel compounds; semiconductor-metal boundaries; silicon; thermal expansion; transmission electron microscopy; 300 to 400 degC; NiSi2-Si; RBS; SAED; Si; Si(111); TEM; dislocations; high-resolution TEM; in situ solid state reaction; interface structure; interfacial steps; island growth; kinetic reaction barriers; nm-sized epitaxial NiSi2 islands; reactive growth; single-crystal substrates; thermal expansion; Kinetic theory; Lattices; Nanostructures; Nickel; Silicon; Solid state circuits; Substrates; Temperature; Thermal expansion; Thermal stresses;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785869