A new technological process of chemical polishing of SC cut crystal units, used for high quality crystal oscillators

Author

Dujkovic, Dragi M. ; Grubisic, Lenkica ; Dedic Nesic, Snezana ; Gavrovska, Ana ; Reljin, Branimir

Author_Institution

Sch. of Electr. Eng., Univ. of Belgrade, Belgrade, Serbia

fYear

2012

fDate

20-22 Nov. 2012

Firstpage

879

Lastpage

882

Abstract

This paper describes a new technological process of chemical polishing of SC cut crystal units. Due to the absence of a deformed layer on the surface of chemically polished units, that is always present in mechanically polished units, and the possibility to inspect crystal defects during abrasion, it is possible to select the defect-free units. Chemically polished units are characterized by improved mechanical durability compared to mechanically polished ones.

Keywords

abrasion; chemical mechanical polishing; crystal oscillators; durability; SC cut crystal unit; abrasion; chemical polishing; chemically polished unit; crystal defect inspection; crystal oscillator; mechanical durability; mechanically polished unit; technological process; Crystals; Educational institutions; Frequency control; Oscillators; Ovens; Presses; Wavelength division multiplexing; Kristalne jedinke; OCXO; SC rez; fazni šum; kristalni oscilatori; visokostabilni kristalni oscilatori;

fLanguage

English

Publisher

ieee

Conference_Titel

Telecommunications Forum (TELFOR), 2012 20th

Conference_Location

Belgrade

Print_ISBN

978-1-4673-2983-5

Type

conf

DOI

10.1109/TELFOR.2012.6419348

Filename

6419348