A new technological process of chemical polishing of SC cut crystal units, used for high quality crystal oscillators

This paper describes a new technological process of chemical polishing of SC cut crystal units. Due to the absence of a deformed layer on the surface of chemically polished units, that is always present in mechanically polished units, and the possibility to inspect crystal defects during abrasion, it is possible to select the defect-free units. Chemically polished units are characterized by improved mechanical durability compared to mechanically polished ones.