DocumentCode :
3063951
Title :
A new technological process of chemical polishing of SC cut crystal units, used for high quality crystal oscillators
Author :
Dujkovic, Dragi M. ; Grubisic, Lenkica ; Dedic Nesic, Snezana ; Gavrovska, Ana ; Reljin, Branimir
Author_Institution :
Sch. of Electr. Eng., Univ. of Belgrade, Belgrade, Serbia
fYear :
2012
fDate :
20-22 Nov. 2012
Firstpage :
879
Lastpage :
882
Abstract :
This paper describes a new technological process of chemical polishing of SC cut crystal units. Due to the absence of a deformed layer on the surface of chemically polished units, that is always present in mechanically polished units, and the possibility to inspect crystal defects during abrasion, it is possible to select the defect-free units. Chemically polished units are characterized by improved mechanical durability compared to mechanically polished ones.
Keywords :
abrasion; chemical mechanical polishing; crystal oscillators; durability; SC cut crystal unit; abrasion; chemical polishing; chemically polished unit; crystal defect inspection; crystal oscillator; mechanical durability; mechanically polished unit; technological process; Crystals; Educational institutions; Frequency control; Oscillators; Ovens; Presses; Wavelength division multiplexing; Kristalne jedinke; OCXO; SC rez; fazni šum; kristalni oscilatori; visokostabilni kristalni oscilatori;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Telecommunications Forum (TELFOR), 2012 20th
Conference_Location :
Belgrade
Print_ISBN :
978-1-4673-2983-5
Type :
conf
DOI :
10.1109/TELFOR.2012.6419348
Filename :
6419348
Link To Document :
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