DocumentCode
3064026
Title
Focused ion beam analysis technology
Author
Wang, Jia Ji ; Chang, Xu ; Zong, Xiang Fu
Author_Institution
Nat. Microanal. Center, Fudan Univ., Shanghai, China
fYear
1998
fDate
1998
Firstpage
311
Lastpage
314
Abstract
In the last decade, focused ion beam (FIB) technology has been attracting attention as a tool with submicron fabrication capabilities because of increasing circuit density and decreasing feature dimension in VLSI devices. This paper introduces basic FIB functions and a number of its technological applications in the field of microelectronics such as microscopic cross-sectioning, transmission electron microscopy (TEM) sample preparation, microcircuit repair and Al microstructure observation. Several examples are presented for these applications
Keywords
VLSI; focused ion beam technology; integrated circuit technology; micromachining; transmission electron microscopy; Al microstructure observation; TEM; VLSI; focused ion beam analysis technology; microcircuit repair; microscopic cross-sectioning; submicron fabrication; Circuits; Conducting materials; Electron beams; Gases; Ion beams; Paper technology; Scanning electron microscopy; Sputter etching; Sputtering; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785883
Filename
785883
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