Title :
Microstructure and fatigue resistance of solder interfaces
Author :
Ku Shang, Jian ; Yao, Daping ; Zhang, Chuosheng
Author_Institution :
Dept. of Mater. Sci. & Eng., Illinois Univ., Urbana, IL, USA
Abstract :
Summary form only given. The relationship between microstructure and fatigue resistance of solder interfaces was studied by examining micromechanisms and micromechanics of fatigue crack growth along a series of model interfaces. While the fatigue crack was seen to prefer staying in the solder when propagating at high rates, interfacial crack sliding was predominant in the near-threshold regime. A micromechanical model of interfacial crack sliding was developed, based on the interface fracture mechanics concept
Keywords :
ageing; fatigue cracks; interface phenomena; interface structure; soldering; fatigue crack growth; fatigue resistance; interface fracture mechanics; interfacial crack sliding; micromechanical model; micromechanics; model interfaces; near-threshold regime; solder interfaces; Cooling; Copper; Fatigue; Geometry; Microstructure; Predictive models; Semiconductor device modeling; Sliding mode control; Temperature; Testing;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785942
