DocumentCode
3065206
Title
Several reliability related issues for flip-chip packaging
Author
Liu, Sheng ; Wang, Jianjun ; Qian, Zhengfang
Author_Institution
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
fYear
1998
fDate
1998
Firstpage
542
Lastpage
545
Abstract
In this paper, several reliability-related mechanics problems in flip-chip packages are discussed. These problems include failure modes (cracking and delamination) and prevention, underfill selection and design, board design effect of processing induced defects (settling effect, incomplete fill, debonding), ball pitch effect, solder joint fatigue, and reliability of conductive epoxy
Keywords
flip-chip devices; integrated circuit packaging; integrated circuit reliability; ball pitch effect; board design; conductive epoxy; cracking; debonding; delamination; fatigue; flip-chip packaging; mechanics; processing defects; reliability; settling effect; solder joint fatigue; thermomechanical failure; underfill; Ceramics; Costs; Delamination; Electronics packaging; Fatigue; Moisture; Passivation; Plastic packaging; Silicon; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785943
Filename
785943
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