• DocumentCode
    3065292
  • Title

    Advanced cooling technology for leading-edge computer products

  • Author

    Chu, R.C.

  • Author_Institution
    Syst. 390 Div., IBM Corp., Poughkeepsie, NY, USA
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    559
  • Lastpage
    562
  • Abstract
    Cooling technology has been a vital prerequisite for the rapid and continued advancement of computer products, ranging from lap-tops to supercomputers. This paper provides a review of the recent development of cooling technology for computers. Both air cooling and liquid cooling are included. Air cooling is discussed in terms of the advantages of impinging flow. An example of module internal conduction enhancement is given. Liquid cooling is discussed in terms of indirect liquid cooling with water coupled with enhanced conduction, and direct immersion cooling with dielectric coolants. Special cooling technology is included in terms of the application of heat pipes and the possibility of using liquid metal flow to cool electronic packages
  • Keywords
    computer peripheral equipment; computers; cooling; heat pipes; packaging; advanced cooling technology; air cooling; dielectric coolants; direct immersion cooling; electronic packages; heat pipes; leading-edge computer products; liquid cooling; liquid metal flow; module internal conduction enhancement; water cooling; Coolants; Coupling circuits; Immersion cooling; Indirect liquid cooling; Portable computers; Power dissipation; Power semiconductor switches; Supercomputers; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4306-9
  • Type

    conf

  • DOI
    10.1109/ICSICT.1998.785947
  • Filename
    785947