Title :
Advanced cooling technology for leading-edge computer products
Author_Institution :
Syst. 390 Div., IBM Corp., Poughkeepsie, NY, USA
Abstract :
Cooling technology has been a vital prerequisite for the rapid and continued advancement of computer products, ranging from lap-tops to supercomputers. This paper provides a review of the recent development of cooling technology for computers. Both air cooling and liquid cooling are included. Air cooling is discussed in terms of the advantages of impinging flow. An example of module internal conduction enhancement is given. Liquid cooling is discussed in terms of indirect liquid cooling with water coupled with enhanced conduction, and direct immersion cooling with dielectric coolants. Special cooling technology is included in terms of the application of heat pipes and the possibility of using liquid metal flow to cool electronic packages
Keywords :
computer peripheral equipment; computers; cooling; heat pipes; packaging; advanced cooling technology; air cooling; dielectric coolants; direct immersion cooling; electronic packages; heat pipes; leading-edge computer products; liquid cooling; liquid metal flow; module internal conduction enhancement; water cooling; Coolants; Coupling circuits; Immersion cooling; Indirect liquid cooling; Portable computers; Power dissipation; Power semiconductor switches; Supercomputers; Temperature; Thermal resistance;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785947