• DocumentCode
    3065362
  • Title

    On the calculation of energy release rate for viscoelastic cracked laminates

  • Author

    Wang, Biao ; Yuen, Matthew M F ; Xiao, Zhongmin

  • Author_Institution
    Sch. of Mech. & Production Eng., Nanyang Technol. Inst., Singapore
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    564
  • Lastpage
    567
  • Abstract
    Generally speaking, the crack in viscoelastic materials will grow in some unknown speed even if the applied load is quasistatic, thus the main difficulty is induced in deriving the energy release rate. In this paper, we redefine the energy release rate (ERR) of crack growth as the energy change at the same time t between the two states of the structure, one is with crack length a under the loading σ(t), the other is the state with crack length a+Δa under the same loading condition. Thus the defined energy release rate corresponds to the released energy when a crack grows suddenly from a to a+Δa. It is found that under a given loading history, the ERR is a function of time, and its maximum value should correspond to the critical state for delamination to propagate. Following William´s work, the explicit expressions of ERR for DCB experimental configurations to measure the interfacial fracture toughness have been obtained through the classical beam assumption
  • Keywords
    cracks; delamination; fracture toughness; laminates; viscoelasticity; DCB; classical beam theory; composite laminate; crack growth; delamination; energy release rate; interfacial fracture toughness; viscoelastic material; Delamination; Elasticity; History; Laminates; Materials science and technology; Mechanical engineering; Plastic integrated circuit packaging; Production engineering; Silicon; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4306-9
  • Type

    conf

  • DOI
    10.1109/ICSICT.1998.785949
  • Filename
    785949