Title :
Reliability test of interconnections using electrical noise measurement
Author :
Massiha, G.H. ; Chen, Charles T M
Author_Institution :
Dept. of Eng., Centenary Coll., Shreveport, LA, USA
Abstract :
The excess electrical noise in aluminum and aluminum alloy thin films were measured. The magnitude and frequency exponent for noise spectra of 1/fα were measured as a function of the sample temperature and current density. Two different regions in plots of normalized 1/fα noise magnitude, with α between 1.2 and 2.2. versus inverse temperature were observed. The time dependence experiment on excess noise of aluminum showed 1/fα, with α larger than 2.2, noise spectra during later stages of the electromigration process
Keywords :
aluminium; aluminium alloys; electromigration; metallic thin films; metallisation; random noise; reliability; 1/falpha noise; Al films; current density; electromigration; excess electrical; frequency exponent; interconnections; noise spectra; reliability test; time dependence; Aluminum alloys; Current density; Current measurement; Density measurement; Electric variables measurement; Frequency measurement; Noise measurement; Temperature; Testing; Transistors;
Conference_Titel :
Southeastcon '92, Proceedings., IEEE
Conference_Location :
Birmingham, AL
Print_ISBN :
0-7803-0494-2
DOI :
10.1109/SECON.1992.202257
