DocumentCode :
3066676
Title :
Practical resolution limit of KrF lithography
Author :
Schuster, Ralf
Author_Institution :
Semicond. Res. & Dev. Center, IBM Corp., Hopewell Junction, NY, USA
fYear :
1999
fDate :
1999
Firstpage :
123
Lastpage :
126
Abstract :
Since lithography represents a major part of chip manufacturing costs it is desirable to extend KrF optical lithography to 0.15 μm design rules and beyond. This paper discusses the resolution limits that can be achieved with state-of-the-art 0.68 NA exposure systems and optical enhancement techniques such as modified illumination, phase shift masks and optical proximity corrections. The goal is to optimize the imaging process to achieve process windows large enough for use in a manufacturing environment
Keywords :
phase shifting masks; proximity effect (lithography); ultraviolet lithography; 0.15 micron; DUV lithography; KrF; KrF excimer laser; chip manufacturing; exposure system; imaging process optimization; off-axis illumination; optical proximity correction; phase shift mask; process window; resolution enhancement technique; semiconductor technology; Apertures; Costs; Focusing; Lenses; Lighting; Lithography; Optical attenuators; Optical imaging; Resists; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications, 1999. International Symposium on
Conference_Location :
Taipei
ISSN :
1524-766X
Print_ISBN :
0-7803-5620-9
Type :
conf
DOI :
10.1109/VTSA.1999.786016
Filename :
786016
Link To Document :
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