Title :
Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses
Author :
Matsuo, Shoichiro ; Oda, K. ; Naoi, Yoshiki
Author_Institution :
Univ. of Tokushima, Tokushima, Japan
fDate :
June 30 2013-July 4 2013
Abstract :
Three dimensional micro removal processing was attempted to crystalline silicon substrate using a 1.56-μm subpicosecond laser. Selective removal was observed on both top and rear surfaces when nitric hydrofluoric acid was used as etchant.
Keywords :
high-speed optical techniques; laser beam etching; microfabrication; optical materials; silicon; Si; crystalline silicon; nitric hydrofluoric acid; selective etching; subpicosecond laser pulses; three-dimensional micromodification; wavelength 1.6 mum; Etching; Optical surface waves; Silicon; Substrates; Surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2013 Conference on
Conference_Location :
Kyoto
DOI :
10.1109/CLEOPR.2013.6600555
