DocumentCode
3067793
Title
The investigation of recessed channel SOI devices
Author
Zhang, Xing ; Huang, Ru ; Xi, Xuemei ; Chan, Mansun ; Ko, Ping K. ; Wang, Yangyuan
Author_Institution
Inst. of Microelectron., Beijing Univ., China
fYear
1998
fDate
1998
Firstpage
720
Lastpage
723
Abstract
Recessed channel SOI devices were investigated. In this paper, the structure and processing of such devices is described in detail. The characteristics of a SOI MOSFET using recessed channel technology are much better than normal thick non-depleted and thin-film fully depleted SOI MOSFETs. The 0.15~4.0 μm recessed channel SOI MOSFETs with a silicon channel film of 70 nm and a source/drain silicon film of 160 nm are developed using a submicron process. The transconductance and drain current are increased by 40% more than thin-film fully depleted SOI MOSFETs
Keywords
CMOS integrated circuits; MOSFET; silicon-on-insulator; SOI MOSFET; drain current; recessed channel SOI devices; submicron process; transconductance; CMOS technology; Etching; MOSFET circuits; Oxidation; Semiconductor films; Silicon; Substrates; Temperature; Thin film circuits; Thin film devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.786075
Filename
786075
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