• DocumentCode
    3067793
  • Title

    The investigation of recessed channel SOI devices

  • Author

    Zhang, Xing ; Huang, Ru ; Xi, Xuemei ; Chan, Mansun ; Ko, Ping K. ; Wang, Yangyuan

  • Author_Institution
    Inst. of Microelectron., Beijing Univ., China
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    720
  • Lastpage
    723
  • Abstract
    Recessed channel SOI devices were investigated. In this paper, the structure and processing of such devices is described in detail. The characteristics of a SOI MOSFET using recessed channel technology are much better than normal thick non-depleted and thin-film fully depleted SOI MOSFETs. The 0.15~4.0 μm recessed channel SOI MOSFETs with a silicon channel film of 70 nm and a source/drain silicon film of 160 nm are developed using a submicron process. The transconductance and drain current are increased by 40% more than thin-film fully depleted SOI MOSFETs
  • Keywords
    CMOS integrated circuits; MOSFET; silicon-on-insulator; SOI MOSFET; drain current; recessed channel SOI devices; submicron process; transconductance; CMOS technology; Etching; MOSFET circuits; Oxidation; Semiconductor films; Silicon; Substrates; Temperature; Thin film circuits; Thin film devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4306-9
  • Type

    conf

  • DOI
    10.1109/ICSICT.1998.786075
  • Filename
    786075