Title :
3-dimensional microelectronic integration
Author :
Bower, Robert W.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., CA, USA
Abstract :
A variety of technologies have been applied to the formation of three-dimensional microstructures in the past two decades. In this talk the author describes work in his group to form three-dimensional structures using direct bonding and smart cut techniques
Keywords :
integrated circuit technology; micromachining; wafer bonding; 3-dimensional microelectronic integration; direct bonding; smart cut techniques; three-dimensional microstructures; three-dimensional structures; Annealing; Bonding; Materials testing; Microelectronics; Microstructure; Nanostructured materials; Semiconductor materials; Silicon compounds; Substrates; Temperature;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.786099
