Survey on the effect of technological metallization and slotting on integrated antenna characteristics

This article contains analysis of influence of metal and dielectric layers, doped regions, and substrate on main antenna characteristics; geometric configuration of metallization and passivating layers. The research was conducted for antennas operating in the frequency range of 5-80 GHz, 0.18 um CMOS technology. Preliminary results show that integrated antennas can allows price reduction up to price of manufacturing of a microcircuit which is being already used in such systems like RFID and mobile systems. Possibility and aspects of applying of designed integrated antennas for data communication channel between different ICs inside same package or within same device were reviewed. Solving of problems mentioned above allows increasing of data transfer rate both inside a package and within device without using lower performance buses on printed boards.