• DocumentCode
    3070121
  • Title

    Suspended nanoparticles as a way to improve thermal energy transfer efficiency

  • Author

    Witharana, S. ; Weliwita, J.A.

  • Author_Institution
    Inst. of Particle Sci. & Eng., Univ. of Leeds, Leeds, UK
  • fYear
    2012
  • fDate
    27-29 Sept. 2012
  • Firstpage
    308
  • Lastpage
    311
  • Abstract
    Nanoparticle suspensions have demonstrated superior heat transfer properties and hence appear to be a strong contender to become next generation coolants. While the presence of particles enhances thermal conductivity, they also contribute to increase the fluid viscosity. The latter will lead to demand more pumping power in convective systems, hence questioning the overall economy of the concept. This paper presents the recently obtained thermal conductivity and rheology data for alumina (Al2O3) and titania (TiO2) nanoparticles suspended in ethylene glycol in the temperature interval of 20-90°C and particle concentrations of 0-8wt%. Although the thermal conductivity enhanced by up to 14%, a simultaneous increase in viscosity dampens the net advantage of using nanoparticle suspensions as convective heat transfer fluids.
  • Keywords
    alumina; convection; coolants; nanoparticles; nanotechnology; organic compounds; rheology; suspensions; thermal conductivity; titanium compounds; viscosity; Al2O3; TiO2; alumina nanoparticle suspensions; convective heat transfer fluids; convective systems; coolants; ethylene glycol; fluid viscosity; particle concentrations; pumping power; rheology data; temperature 20 degC to 90 degC; temperature interval; thermal conductivity enhancement; thermal energy transfer efficiency improvement; titania nanoparticle suspensions; Conductivity; Heat transfer; Nanofluidics; Nanoparticles; Temperature measurement; Viscosity; alumina; energy; ethylene glycol; nanoparticles; thermal conductivity; titania; viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information and Automation for Sustainability (ICIAfS), 2012 IEEE 6th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4673-1976-8
  • Type

    conf

  • DOI
    10.1109/ICIAFS.2012.6419922
  • Filename
    6419922