DocumentCode
3070152
Title
The reliability of amorphous silicon thin film transistors for LCD under DC and AC stresses
Author
Cheng, Huang-Chung ; Huang, Chun-Yao ; Lin, Jing-Wei ; Kung, Jerry Ji-Ho
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
1998
fDate
1998
Firstpage
834
Lastpage
837
Abstract
In this paper, hydrogenated amorphous silicon and polycrystalline silicon thin film transistors have been stressed with various conditions including DC and AC. Charge trapping and defect state creation are the two mechanisms to degrade the transfer characteristics of the TFTs. For a-Si:H TFTs, the charge trapping occurs at a high silicon content in silicon nitride (SiNx) gate dielectrics or performs at high gate electrical field. Defect state creation dominates at low hydrogen concentration in a-Si:H. At the performance of AC signal, the degradation of transfer curves is associated with bias, frequency, and duty cycle. The characteristics of a-Si:H TFTs shift more with increasing bias voltage and duty cycle. For the frequency effect, the transfer characteristics of a-Si:H TFTs decrease with increasing AC frequency under negative AC signal stress, however, they are independent of the frequency under positive AC signal stress
Keywords
amorphous semiconductors; electron traps; elemental semiconductors; hydrogen; integrated optoelectronics; liquid crystal displays; semiconductor device reliability; silicon; thin film transistors; AC stress; DC stress; LCD; Si:H; bias voltage; charge trapping; defect state creation; duty cycle; gate electrical field; hydrogen concentration; hydrogenated amorphous silicon; reliability; thin film transistors; Active matrix liquid crystal displays; Amorphous silicon; Degradation; Electrodes; Frequency; Reliability engineering; Stress; Temperature dependence; Thin film transistors; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.786201
Filename
786201
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