• DocumentCode
    3070158
  • Title

    High frequency ultrasound imaging of surface and subsurface structures of fingerprints

  • Author

    Saijo, Yoshifumi ; Kobayashi, Kazuto ; Okada, Nagaya ; Hozumi, Naohiro ; Hagiwara, Yoshihiro ; Tanaka, Akira ; Iwamoto, Takahiro

  • Author_Institution
    Biomedical Imaging Laboratory, Graduate School of Biomedical Engineering, Tohoku University, Sendai, Japan
  • fYear
    2008
  • fDate
    20-25 Aug. 2008
  • Firstpage
    2173
  • Lastpage
    2176
  • Abstract
    High frequency ultrasound is suitable for non-invasive evaluation of skin because it can obtain both morphological and biomechanical information. A specially developed acoustic microscope system with the central frequency of 100 MHz was developed. The system was capable of (1) conventional C-mode acoustic microscope imaging of thinly sliced tissue, (2) ultrasound impedance imaging of the surface of in vivo thick tissue and (3) 3D ultrasound imaging of inside of the in vivo tissue. In the present study, ultrasound impedance imaging and 3D ultrasound imaging of in vivo fingerprints were obtained. The impedance image showed pores of the sweat glands in the surface of fingerprint and 3D ultrasound imaging showed glands of the rear surface of fingerprint. Both findings were not visualized by normal optical imaging, thus the system can be applied to pathological diagnosis of skin lesions and assessment of aging of the skin in cosmetic point of view.
  • Keywords
    Acoustic imaging; Fingerprint recognition; Frequency; In vivo; Microscopy; Optical imaging; Skin; Surface impedance; Surface morphology; Ultrasonic imaging; acoustic microscopy; component; fingerprint; skin; three-dimensional imaging; Dermatoglyphics; Electric Impedance; Humans; Image Enhancement; Imaging, Three-Dimensional; Microscopy, Acoustic; Sensitivity and Specificity; Skin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-1814-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2008.4649625
  • Filename
    4649625